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26 DESIGN007 MAGAZINE I AUGUST 2025 U H D I F U N DA M E N TA LS by A n a ya Va rd ya , A m e r i c a n S ta n d a rd C i rc u i t s UHDI Technology and AI U ltra high density interconnect (UHDI) technology is revolutionizing the design and deployment of artificial intel- ligence (AI) systems, particularly in domains requiring compactness, high- speed processing, and power efficiency. This article explores the synergy between UHDI and AI, detailing how UHDI supports advanced computing architectures, edge AI deployments, wearable intelligence, and next-generation neural processing units. As AI becomes embedded in every- thing from autonomous vehicles to smart sensors and medical diagnostics, the supporting electronics must evolve to meet unprecedented demands in size, speed, and efficiency. UHDI technology, with its microvia structures, ultra-fine lines, and high interconnect densities, offers a scalable physical platform for these advanced AI solutions. Overview of UHDI Technology UHDI is an advanced PCB technology distiguished by: • Line/space geometries of ≤25 µm • Stacked and staggered microvias • Embedded resistors and capacitors • High density interconnection and routing • Advanced material compatibility for high-speed signals These capabilities enable system-level integration of logic, memory, communication, and power management into com- pact, high-performance boards. Application Areas of UHDI in AI • Edge AI systems: These are used in smart cameras, autonomous drones, and factory monitoring. UHDI allows CPU, GPU, memory, and wireless integration in limited space. • Wearable AI devices: Health monitors, AR headsets, and biometric devices benefit from UHDI's compact and lightweight designs. • Robotics and autonomous platforms: UHDI enables high-bandwidth communication between sensors, motors, and onboard AI processors. • Neural network accelerators and AI chips: UHDI sup- ports the high-density connections between logic units, memory banks, and I/O. This is essential for ASIC- based AI and FPGA boards.