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Design007-Aug2025

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60 DESIGN007 MAGAZINE I AUGUST 2025 4 3 2 1 5 New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS' ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry. DESIGN007 TOP 10 C h e c k o u t t h e s e h i g h l i g h t s f r o m D E S I G N 0 0 7 . c o m Flexible Circuit Technologies Welcomes Regional Business Development Manager Derek Rossberg Flexible Circuit Technologies a Minnesota-based flexible circuit and advanced electronics contract manufacturer, welcomes Derek Rossberg as regional business development manager. Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits Inherent cavity resonant modes often lead to significant degradation of shielding effectiveness, responsible for unwanted electromagnetic coupling. Cavity resonant modes of the metal shielding enclosure can produce two adverse problems: the mutual coupling among different RF modules and shielding effectiveness reduction of the metal enclosure. Creating a Design Constraint Strategy Is there a set of best practices for setting constraints? That's what I asked Global Electronics Association design instructor Kris Moyer, who covers design constraints in his classes. In this interview, Kris discusses how to identify PCB design requirements and set design constraints tightly enough for performance but flexible enough for manufacturing limitations. Beyond Design: Refining Design Constraints Before starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.

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