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PCB007-Aug2025

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92 PCB007 MAGAZINE I AUGUST 2025 4 3 2 1 5 P C B 0 07 TO P 1 0 C h e c k o u t t h e s e h i g h l i g h t s f r o m P C B 0 0 7 . c o m AI Is the Golden Track Reviving Electronics and PCBs Remember 2021? Despite COVID, the electronics industry hit a high. Then came the slide. By 2023, the industry was deep in the red. With inflation, policy shifts, and exchange rate shocks, the problems were long, and the outlook was bleak. Recovery finally appeared in 2024, but it was fragile. Automotive electronics slumped, wireless demand stayed soft, and the ride up was anything but smooth. Yet, amid the uncertainty, one bright track emerged: artificial intelligence (AI). Driving Innovation: Inner Layer Alignment Methods in PCB Production In PCB manufacturing, precision is a fundamental requirement. Among many complex processes, the accurate registration of inner layers before lamination is one of the most critical. PCB manufacturers align multiple conductive and insulating layers to form a cohesive, functional board. This directly affects PCB precision; tighter layer alignment results in smaller "annular rings," superior performance, and higher yields. Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress Metallizing materials, such as polyimide, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces. The Chemical Connection: Sales Organization from a Capital Equipment Perspective The sales organization for a capital equipment supplier to the PCB industry tends to differ slightly from a supplier that manufactures and sells circuit boards to their customers. After all, our sales depend on the printed circuit board manufacturer's sales. If business falls off, you tend to delay or reconsider the need for new or upgraded capital equipment, and then our sales fall off. If your sales go up and you need to increase capacity or replace old equipment, our sales also trend upwards. UHDI Fundamentals: UHDI Technology and Industry 4.0 Ultra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high- performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.

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