PCB007 Magazine

PCB007-Aug2025

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AUGUST 2025 I PCB007 MAGAZINE 93 10 9 8 7 6 Advancing Electrolytic Copper Plating for AI-driven Package Substrates Electrolytic copper plating is a key process in package substrate manufacturing, significantly impacting subsequent stages such as etching. A major challenge in electrolytic plating is ensuring uniform copper distribution across the entire panel, whether in areas with a high density of holes or more isolated sections. Such high hole-density regions are integral to modern multilayer board (MLB) designs, despite introducing several manufacturing complexities. Dan's Sales Guide: Master Your Sales Game in 2025 and Beyond Industry veteran Dan Beaulieu has compiled more than 80 of his favorite sales tips and suggestions to help you create your own sales and marketing playbook. "I've been in this business for over 40 years, and I've seen companies spend hundreds of thousands of dollars on equipment, expand factories, rebrand multiple times, and hire consultants until the parking lot is full," Dan says. But when it comes to time for companies to invest in something that will actually grow their revenue, Dan has found that their sales and marketing strategies aren't as strong as they should be. PCBAA's David Schild: Where U.S. Electronics Manufacturing Stands Today As the U.S. Congress looks toward a summer break, David Schild of PCBAA discusses the growing momentum in U.S. electronics manufacturing policy, emphasizing bipartisan support for reshoring efforts, the importance of targeted tax incentives, and the challenges posed by global competition. He highlights PCBAA's growth, advocacy on Capitol Hill, and the need for sustained investment to revitalize the PCB industry. Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication There has always been a subtle but significant divide between those who design and those who build printed circuit boards. It's not a hostile gap, but it is a real one, and in today's high- speed, high-complexity, high-stakes environment, that gap is costing us more than time and yield. It's costing us innovation. PCB designers are brilliant problem-solvers, as are fabricators. Yet too often, they're solving distinct problems on separate timelines, with different sets of constraints. Global Citizenship: The Global Push for Digital Inclusion It can be too easy to take the technology at our fingertips for granted: high-speed internet, cloud-based collaboration, and instant video calls across continents. Yet, for billions of people, access to these digital tools is a distant dream. Here is how technology is bridging physical, economic, and educational gaps in underserved regions and profoundly reshaping lives. Underserved regions include rural, impoverished, or geographically isolated areas, where roads are unreliable, electricity is scarce, and traditional infrastructure is limited or nonexistent.

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