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untreated after 1.0μm etching by CZ MEC from Uyemura Industry's Ultimate Copper Surface Treatment Copper Surface 0 20 40 60 2000 2010 2015 2020 2025 2030 1.0μm 0.5μm 2025 Beta Testing 1.5μm Mininum Line Width (μm) 4 th generation 0.1μm etching 2 nd generation 1.0μm etching 3 rd generation 0.5μm etching 1 st generation 1.5μm etching Corporate Headquarters: 3990 Concourse, #425 • Ontario, CA 91764 • ph: (909) 466-5635 Tech Center: 240 Town Line Road • Southington, CT 06489 • Ph: (860) 793-4011 sales1@uyemura.com www.uyemura.com 1.0μm 0.5μm 0.1μm Copper crystal boundaries Copper crystals Small Cu crystals remain Control depth direction etching with remaining small Cu crystals MECetchBOND CZ Series Organic acid-type copper micro-etching solution creates a unique roughened surface and achieves a higher physical adhesion to a variety of resins, including build-up resin, dry film etch resist and solder mask. Bonding by Anchor Effect MEC's CZ Series produces a unique super- fine surface roughness by preferential etching of copper surfaces. Resin systems applied to this surface solidify, creating an extremely strong bond. AP Series This process improves the adhesion of copper and resin by combining an ultra-low etched, unique roughened surface and an organic film. It achieves the best adhesion to multiple common resins with minimal effect on pattern dimensions. MECetchBOND CL-8325C is an anti- bleed pre-treatment for Inkjet Solder Mask Processes. CL-8325C changes copper contact angle, modifying surface tension and preventing solder mask bleed on copper and laminate. Standard operating temperature is 77°F. The pairing of CZ and CL-8325 streamlines the 5 steps required by conventional methods to just 3, reducing overall process cost. (chemical adhesion) 0.1μmv +AP