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SEPTEMBER 2025 I SMT007 MAGAZINE 65 K N O C K I N G D OW N T H E B O N E P I L E Inspection and quality control are essential at this stage. Coplanarity verification, Z-height measurement, and checks for missing, misaligned, or insufficient solder volume help ensure reliability. Detection of shorts, foreign object debris, or hidden defects via X-ray or endoscopic inspection adds an extra layer of assurance. Optional solderability testing according to IPC-J-STD-002 can confirm wetting and alloy comp- atibility, ensuring the component is ready for reuse. Cleaning and Moisture Control After reconditioning, it's essential to clean compo- nents with appropriate aqueous or solvent-based methods to remove flux residue and contaminants. A post-cleaning bake-out per IPC-J-STD-033 is critical to eliminate absorbed moisture, preventing popcorning during any subsequent reflow in new assemblies. Component Reclamation Effective reclamation relies on specialized tools and trained operators. Professional soldering stations, hot air or IR rework sys- tems, RHSD machines, optical and X-ray inspection systems, cleaning systems, bake ovens, and ESD-safe hand tools and fixtures all play a role. Operators must consistently follow MSD handling per J-STD-033 and ESD protocols, such as ANSI/ESD S20.20, to avoid component damage. Salvaging efforts focus on high-value or long-lead-time parts, primarily surface mount devices including BGAs, LGAs, QFNs, specialty ICs, and other high-reliability components. Properly reconditioned and tested, these com- ponents can be reused in new PCB assemblies, helping reduce lead times, lower manufacturing costs, and decrease environmental impact. Post-reconditioning Processing Reclaimed components require proper labeling, packaging, and storage to maintain traceability and quality. Laser marking ensures identification, while packaging options like EIA-481 tape-and-reel or JEDEC trays protect the devices. Storage in vacuum-sealed, moisture-barrier bags with desiccants and moisture indicator cards, along with controlled temperature and humidity per IPC-J-STD-033, preserves component integrity until they are ready for reuse. When outsourcing reclamation, select partners with proven experience in BGA and high-value component salvaging. They should demonstrate adherence to MSD, ESD, and environmental, occupational, and safety (EOS) standards, ensuring reliable results that meet industry expectations. ▼ F i g u re 2 : O n c e re m ove d , c o m p o n e nt s m u st b e re c o n d i t i o n e d to re sto re l e a d s , p a d s , o r s o l d e r b a l l s a n d p re p a re t h e m fo r re u s e. ▼ F i g u re 3 : S a l va g i n g ef fo r t s fo c u s o n h i g h -va l u e o r l o n g - l e a d -t i m e p a r t s .