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54 DESIGN007 MAGAZINE I SEPTEMBER 2025 C O N N ECT T H E D OTS Evolution of PCB Manufacturing: Lamination by Mat t Stevenson, ASC Sunstone C ircuits When I wrote The Printed Circuit Designer's Guide to... Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That's why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner. Specifications keep calling for smaller, more durable, and increasingly complex multilayer boards. The lamination process is a key production compo- nent for complex multilayer PCBs where multiple layers are needed to achieve desired functionality with a small footprint in tight spaces, often at high temperatures. I believe designers benefit from a clear under- standing of the materials and processes used dur- ing all aspects of production. When designing mul- tilayer boards for manufacturability, understanding the manufacturing process downstream from your design will prevent headaches and costly delays. The lamination process also allows designers to improve the durability and functionality of the man- ufactured board, as well as potentially reducing materials cost and streamlining production. The Evolving Lamination Process Methods of fusing multilayer boards have come a long way. If you go back far enough, it involved the use of Masonite, rivets, and cardboard. The devel- opment of flame-retardant (FR-4) epoxy-glass mate- rials led to better thermal management, reduced signal loss, and improved manufacturability. Polyimide paved the way for widespread flex and rigid-flex PCB design and manufacturing. Advancements such as these (along with con- sistent incremental change) led designers to learn new tricks and techniques to ensure their designs are ready for modern manufacturing. We have seen the average multilayer PCB design transform significantly in recent years, driven by the increas- ing demand for boards that power compact and feature-rich electronic devices. However, more layers equate to more materi-