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Design007-Sept2025

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SEPTEMBER 2025 I DESIGN007 MAGAZINE 19 Mitigation tactics against latency: • Material mastery: Deploy low-Dk laminates to accelerate signal velocity and weaken his dielectric grip. • Trace discipline: Match trace delays with ruthless accuracy, especially in differential pairs and timing-critical buses, to sever his serpentine influence. • Geometry control: Select transmission line formats (stripline, CPW) with strategic intent, balancing shielding and delay to neutralize his geometric traps. • Route symmetry: Deploy critical synchronous buses (like DDR) across perfectly mirrored lay- ers. This symmetrical routing forms an impen- etrable barrier, ensuring impedance uniformity and denying him the imbalance he feeds on. • Predictive modeling: Use field solvers and simulation tools to expose hidden delay paths and preempt his interference before layout lockdown. Key Points • It's often possible to track down the source after the fact; however, a proactive approach offers the greatest defense. • With vigilant stackup planning, disciplined fab- rication, precise impedance modeling by field solvers, and well-placed terminations, you can corner the Terminator before he can strike. • Switching signals that pass through the cavity induce noise into other signals. Treating the plane pair as a radial transmission line and terminating it in its characteristic impedance can suppress reflections and standing waves. • A region under a large BGA densely populated with vias also appears as a discontinuity because of the large array of anti-pads eating a hole in the plane. To open up planes under BGAs, use via-in-pad, shrink the antipad diam- eter, and use teardrops to offset antipads. • Dangling via stubs can distort signals passing through an interconnect and also decrease the usable bandwidth of the signal. Back-drill the plating to remove the residual stub, or route the signal through the full length of the via barrel. • Spacing is the best defense against crosstalk. Increase the separation between critical traces. Alternatively, tightly couple the signal to the reference plane. • Maintain consistent reference planes beneath critical signals; avoid splits or gaps. Tie unused zones to ground or eliminate them. • Add ground vias near every plane transition or add decaps to each power plane near the transition. Create a clear path for return cur- rents to flow smoothly. • Match trace delays with ruthless accuracy, especially in differential pairs and timing- critical buses. • Deploy critical synchronous buses (like DDR) across perfectly mirrored layers. DESIGN007 Resources 1. "Beyond Design: Standing Waves in Multi- layer PCB Plane Cavities", by Barry Olney. 2. "Beyond Design: How to Handle the Dreaded Danglers Part 1", by Barry Olney. 3. "Beyond Design: How to Handle the Dreaded Danglers Part 2", by Barry Olney. 4. "Beyond Design: Dampening Plane Reso- nance with Termination", by Barry Olney. Barry Olney is managing director of In-Circuit Design Pty Ltd (iCD), Australia, a PCB design service bureau that specializes in board- level simulation. The company developed the iCD Design Integrity software, incorporating the iCD Stackup, PDN, and CPW Planner. You can download the software at www.icd.com.au. To read past columns, click here. B E YO N D D ES I G N

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