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SEPTEMBER 2025 I DESIGN007 MAGAZINE 23 ing it could stretch out without getting zapped. By the time it scrapes through to the other side, the signal becomes hunched, jittery, and carries a noise it never asked for. Just when the signal thinks the course has leveled out, it hits the dreaded mud pit. This is attenuation, the slow, relent- less drag that doesn't trip it outright but saps strength with every step. At first, the surface looks harmless, almost invit- ing, but the instant its feet touch, for- ward motion turns into a slog. Each stride grows heavier. The copper's resistance tugs at it like thick mud clinging to its boots, while the dielectric loss is the pit, quietly swallowing a little more energy with every move forward. Progress becomes more difficult, the pace slows, and the effort needed for each step seems to double. At the end, a signal's journey across a PCB is only as safe as the environment we build for it. In a well-balanced electro- magnetic ecosystem, the obstacles are small and predictable. The signal might break a sweat, but it crosses the finish line strong and ready for work. In a toxic, uncontrolled environment, every hazard becomes amplified. Walls are higher, the barbed wire hangs lower, the trapdoors drop deeper, and the mud pits stretch for miles. By the time the signal reaches the receiver, it's been pushed, slowed, and battered into something unrecognizable. Unlike an obstacle course runner, it won't limp away to train for next time; it will simply fail, and take your design down with it. DESIGN007 John Watson is a professor at Palomar College, San Marcos, California. To read past columns, click here. E L E M E N TA RY, M R . WATS O N The global HDI PCB Market is estimated to be valued at US$19.59 billion in 2025 and is expected to reach $34.23 billion by 2032, exhibiting a compound annual growth rate (CAGR) of 8.3% from 2025 to 2032. The market for high-density interconnect (HDI) printed circuit boards (PCBs) is rapidly evolving, driven by the demand for smaller, lighter, and higher-performing electronic devic- es. Advances like embedded components and cutting- edge materials are enhancing circuit density and reli- ability. This expansion is largely supported by increas- ing use in automotive electronics, telecommunications, and consumer electronics sectors. According to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching $19.59 billion in 2025 and $34.23 billion by 2032. Based on technology node, the FR-4 segment is slat- ed to account for 31.8% of the global HDI PCB market share by 2025. HDI PCB demand is expected to remain high in smartphones and mobile devices, with the target segment accounting for 29.3% of the market revenue share in 2025. Asia Pacific is anticipated to remain the undisputed leader in HDI PCB technology, accounting for more than three-fourths of the global market share in 2025. Europe is set to create lucrative growth opportunities for HDI PCB companies throughout the forecast period. Coherent Market Insights' new HDI PCB market anal- ysis outlines prominent factors driving the industry's growth. One such key growth factor is the increasing adoption of miniaturized electronics. Demand for smaller, lighter, and high-performance devices like smartphones, wearables, medical implants, and IoT gadgets is increasing rapidly. This trend is ex- pected to accelerate the adoption of HDI PCBs during the forecast period. (Source: CMI) HDI PCB Market Projected to Hit $34.23 Billion by 2032