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40 PCB007 MAGAZINE I SEPTEMBER 2025 F E AT U R E A RT I C L E by J o h n C o o n ro d , Ro g e rs C o r p o ra t i o n B y the 1970s, Rogers Corporation's high-fre- quency laminates had already become integral to some of the most ambitious engineering projects in history. The RT/duroid® 5000 materials powered the high-frequency command and data communication systems for NASA's Voyager 1 and 2 spacecrafts, launched in 1977. These probes— still transmitting data today more than 13 billion miles from Earth—demonstrate the reliability and performance of the materials under the most de- manding conditions. Around the same time, RT/duroid 5880 material established itself as an industry benchmark for ex- ceptional RF performance and ultra-low dissipation factor, paving the way for future generations of ad- vanced circuit materials. Building on the RT/duroid platform, we expanded our portfolio to address both RF performance and ease of circuit fabrication. The introduction of RO4350B™ laminates marked a major milestone: one of the world's first non-PTFE high-frequency materials. This material offers excellent process- ability, low loss, multilayer capability, and strong thermal and mechanical properties, making it ideal for complex PCB assemblies. Its versatility quickly led to widespread adoption, particularly in cellular infrastructure, where performance and manufacturability were equally critical. As cellular networks grew in complexity, Rogers optimized this material further, introducing RO4835™ materials. While maintaining the same electrical performance as RO4350B, RO4835 laminate offers a 10x improvement in thermal ag- ing resistance, a vital benefit for long-term reli- ability. With the rollout of 5G infrastructure, we ex- tended the product family again with RO4835T™ materials, delivering more thickness variations and expanded design flexibility. The aerospace and defense sector has also played a central role in our material innovations. Engineering Breakthroughs in High-frequency Circuit Materials