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50 SMT007 MAGAZINE I OCTOBER 2025 K N O C K I N G D OW N T H E B O N E P I L E Revamp Your Components With BGA Reballing Ball grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configu- rations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint. BGA Advantages BGAs offer several advantages compared to other package types: • High circuit density: Their compact layout supports advanced miniaturization trends in electronics • Improved heat conductivity: Short thermal paths reduce internal chip overheating by Nash B ell, BEST, Inc. • Low inductance: The shorter interconnects minimize signal distortion at high frequencies Because of these benefits, BGAs have become the backbone of advanced electronics, including smart- phones, automotive ECUs, aerospace systems, and defense-grade modules. Lack of Compliance One tradeoff with BGAs is their lack of mechanical compliance. Unlike packages with leads that flex, solder balls are rigid. This makes BGAs susceptible to stress from: • Thermal cycling (differences in coefficient of thermal expansion between the package and PCB) • Vibration and mechanical flexing in demanding environments To mitigate this, underfill materials are commonly applied to redistribute stress and improve mechani- E x a m p l e o f c l e a r p r o t e c t i v e s i l i c o n e g e l o v e r B G A p i n s . ▼