Issue link: https://iconnect007.uberflip.com/i/1539960
12 SMT007 MAGAZINE I OCTOBER 2025 8. Augment data, if needed, to increase size and diversity, and to enhance data that mim- ics real-world data. 9. Test and iterate by running a small model on a subset of data to spot issues. 10. Continue monitoring data quality by regularly assessing datasets to reflect changing condi- tions or new information. 11. Always keep records of data sources. Challenges and Concerns With AI Data Data quality and data volume are demanding areas, as LLMs (e.g., ChatGPT-4 and ChatGPT-5) require massive datasets. While the overall volume of data is growing, there is a shortage of diverse and high- quality data; noisy or biased data leads to poor model performance. Other challenges include data aging and data poisoning. Data aging refers to data losing its relevance, accuracy, or value over time. To mitigate this, implement data retention policies, adopt tiered storage practices, and regularly purge and delete outdated data. Data poisoning is a type of cyberattack. Malicious actors may spread misinformation or insert incor- rect or misleading information into the data or tam- per with the data used to train AI models. Hackers could attempt to poison an AI model's training data and introduce security vulnerabilities, and then they could exploit them later using various attack vec- tors. For example, hackers may inject false informa- tion into websites, generating corrupted data. The difficulty lies in detecting and removing such poi- soned data, as even a small amount can compro- mise an AI system's output. Module 2 on "Data" will highlight the alternative approaches in data requirements, synthetic data, data governance, the role of Retrieval-Augmented Generation, and Agentic RAG in data. SMT007 References 1. UBS Research (www.UBS.com). Appearances Dr. Jennie Hwang will deliver a Professional Development Lecture, "Reliability of Electronics— Solder Joint Reliability," at SMTA International, Oct. 20, in Chicago. She will instruct three Global Electronics Association Professional Development webinar courses: "PoP Packaging and Assembly—Materials, Processes, Reliability," Nov. 11 and 13; "BTC Packaging and Assembly—Materials, Processes, Reliability," Nov. 18 and 20; and "Reliability of Electronics—Solder Joint Voids, All You Should Know," Dec. 2 and 4. D r. J e n n i e S . H w a n g , a n international businesswoman, speaker, and business and technology advisor, is a pioneer and long-standing leader in SMT manufacturing since its inception, and in developing and implementing lead-free electronics technology and manufacturing. She has served as chair of Artificial Intelligence- Justified Confidence for DoD Command and Control study, chair of AI Committee of the National Acad- emies, and Review Panels of NSF National AI Insti- tutes and Committee of Strategic Thinking for Engi- neering Research. An International Hall of Famer (Women in Technology), she has been inducted into the National Academy of Engineering, named an R&D-Stars-to-Watch, and received the YWCA Achievement Award. She has held senior executive positions with Lockheed Martin Corp., and was CEO of International Electronic Materials Corp. She is cur- rently CEO of H-Technologies Group, providing busi- ness, technology, and manufacturing solutions. She has served as chair of the Laboratory Assess- ment Board, the DoD Army Research Laboratory Assessment Board, and the Assessment Board of Army Engineering Centers. She is on the board of Fortune-500 NYSE companies and civic and univer- sity boards, Commerce Department's Export Coun- cil, National Materials and Manufacturing Board, NIST Assessment Board, various national panels/ committees, and international leadership positions. She is the author of 10 books (four as co-author) and 750+ technical/editorial publications. She is a speaker and author on trade, business, and educa- tion issues. Her formal education includes four aca- demic degrees (Ph.D., M.S., M.A., B.S.), as well as Harvard Business School Executive Program and Columbia University Corporate Governance Pro- gram. To read previous columns, click here. S M T P E RS P ECT I V ES & P RO S P ECTS