Issue link: https://iconnect007.uberflip.com/i/1540184
36 DESIGN007 MAGAZINE I OCTOBER 2025 Flexibility for Multiple Design Configurations Another particularly valuable aspect of the optimi- zation process is its ability to accommodate differ- ent programmable device images (PDI) deployed on the same hardware. Each PDI can have different dynamic power requirements and step load charac- teristics, while offering various features and perfor- mance levels. Today's tools allow engineers to use the same board layout with different bills of mate- rials, optimizing the step load response to match specific PDI requirements. This flexibility extends to supporting multiple opti- mization goals. While the case study focused primar- ily on cost reduction, the same methodology can be applied to optimize for other objectives such as: • Maximum performance margin • Minimum component count • Reduced board space utilization • Enhanced manufacturing efficiency The optimization process addresses both electri- cal and manufacturing requirements. Reducing the number of distinct component types from seven to six might seem minor, but it can significantly impact inventory management and assembly processes. Using standard supplier part libraries in the optimi- zation ensures procurement viability. Conclusion As SoC devices evolve, power delivery require- ments will become increasingly demanding. The methodology presented here provides a frame- work for addressing future challenges through scal- able optimization that adapts to new device require- ments and supports multiple power domains. PDN optimization can achieve seemingly contradic- tory goals: improving performance while reducing costs. The ability to reduce component count by nearly 50% while maintaining or improving perfor- mance illustrates the power of sophisticated optimi- zation techniques. This approach becomes particu- larly important as device frequencies increase and power requirements become more stringent. The collaboration between silicon vendors and EDA tool providers creates a comprehensive eco- system that enables engineers to stay ahead of evolving design requirements. AMD's provision of detailed S-parameter models for all Versal prod- uct lines, combined with sophisticated optimization tools, ensures that designers can continue to meet future challenges effectively. Success in PDN optimization ultimately depends on balancing multiple competing factors: electri- cal performance, cost efficiency, manufacturing considerations, and design configuration fl exibil- ity. Modern tools provide engineers with the capa- bilities needed to achieve this balance effectively, enabling robust PDN solutions that address today's requirements while preparing for tomorrow's power delivery challenges. For more information, please read this white paper from Siemens EDA. DESIGN007 Zach Caprai is a technical marketing engineer at Siemens, specializing in the HyperLynx suite of analysis tools for PCB design.