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64 DESIGN007 MAGAZINE I OCTOBER 2025 technologies evolve, potting materials will play an increasingly vital role in ensuring long-term perfor- mance and reliability. The miniaturization of electronics and the rise in component density are reshaping the demands placed on potting materials. These materials must be capable of flowing into narrower gaps and smaller cavities, providing full coverage while avoiding stress on delicate components. This trend is driving the development of low-viscosity, low-modulus formula- tions that protect without adding unnecessary weight. Looking ahead, innovation in material science and processing will focus not only on performance and manufacturability but also on sustainability. To that end, new formulations are expected to incor- porate solutions that support disassembly and recy- cling at end-of-life, helping designers meet both technical and environmental goals. DESIGN007 Beth Massey is the global product manager for Electrolube potting compounds. To learn more about advanced potting materials and how Mac- Dermid Alpha Electronics Solutions supports next-generation electronic designs, visit macdermidalpha.com or contact us to explore solutions optimized for your application. General purpose encapsulation resins are suit- ed to a wide range of applications where protection and electrical insulation are required. Typically, they show good flow and self-levelling properties to com- pletely encapsulate all components. Good flow prop- erties are important to prevent air entrapment that can occur when the vis- cosity is so high that air is unable to escape. The pot life, work- ing life, and gel time can vary greatly from prod- uct to product. Pot life measurements are use- ful to understand how a mixed system is likely to flow when dispensed into a unit. Both the gen- eral-purpose epoxy (GPE) and polyurethane typi- cally show good initial flow properties and are suited to most potting applications. The general-purpose polyurethane (GPP) shows a lower mixed system vis- cosity, so might be more suited to applications with tight spacing between components or leads. The pot life of the GPE is longer, meaning it will retain its workable and flow properties for more time. Good adhesion is essential to completely seal a module. Adhesion to wires, leads, terminals, and housing materials is required for complete physi- cal protection against deleterious fluids and oth- er contaminants. As the popularity of portable and wearable electronics continues to rise, everyday devices must be able to tolerate exposure to dust and moisture, thus ruggedized performance is es- sential for both indoor and outdoor environments. Ingress protection (IP) ratings describe protection against solids and liquids. To achieve any decent level of protection at a system level, an encapsu- lation resin must adhere appropriately to the sub - strates to which it is applied. Lap shear strength testing is a useful method to compare adhesive strength on different substrates. Test methods such as ASTM D1002 (metals) and ASTM D3163 (plastics) provide a useful framework to compare the adhesive performance of encapsula- tion resins, evaluate effectiveness of surface prep- aration techniques, and assess durability of bonded substrates in different environments. Continue reading... The Printed Circuit Assembler's Guide to... Encapsulating Sustainability for Electronics BOOK EXCERPT Chapter 3: Industry Sectors and Relevant Test Methods By Beth Turner, MacDermid Alpha Electronics Solutions