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info @ atotech.com www.atotech.com Redefining copper deposition for next-gen. package substrates To find out more about Printoganth MV TP3, scan the QR Code to the right. Printoganth ® MV TP3 – Precision, reliability, and performance in every layer Meet Printoganth MV TP3, the latest evolution in high-throwing-power electroless copper for SAP build- up technology. Designed for next-generation package substrates, MV TP3 delivers a dense uniform copper that can be adjusted in thickness from 100 to 500 nm, and ensures exceptional peel strength, even on ultra-smooth laminates. Its advanced stabilizer system guarantees controlled, predictable deposition with no dummy plating required, while supporting "bottom-up" recrystallization for unmatched interconnect reliability. Backed by MKS' Atotech's market-leading expertise, Printoganth MV TP3 sets a new standard for fine-line capability and long-term performance. Ready to push the limits of miniaturization? Contact us today and discover how Printoganth MV TP3 can optimize your SAP process.