Community Magazine

Community-Fall2025

IPC International Community magazine an association member publication

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FA L L 2 0 2 5 C O M M U N I T Y M A G A Z I N E 1 3 The future of advanced packaging is being shaped right here in the United States. In September, the Global Electronics Association acted as co-hosts with the International Microelectronics Assembly and Packaging Soci- ety (IMAPS) to bring together government leaders, the Defense Industrial Base, and industry experts to chart the path forward at the Onshoring Advanced Packaging Workshop in Arlington, Virginia. Keynote speakers included Dev Shenoy, director of advanced technolo- gies, USC Information Sciences Institute, University of Southern California; Carl McCants, principal engineer at Intel Corporation; Michael Holmes, program manager, Defense Advanced Research Projects Agency (DARPA) Next Generation Microelectronics Manufacturing; and Dr. Yogendra Joshi, DARPA Minitherms 3D program manager. The mission of this workshop was to engage our workforce community in identifying the newly created advanced packaging programs. These programs address the U.S. government and defense requirements crit- ical to the onshoring of the microelectronics assembly and packaging supply chain. Advancing Government and Defense Interests The Global Electronics Association partnered with the European Space Agency for the Electronics Manufacturing & Packaging Symposium (EMPS) 2025 in early October at the ESA/ ESTEC headquarters in Noordwijk, the Netherlands. This event focused on the latest developments in PCBs, electronic as- sembly, and packaging technologies. While space applications remained a core focus, the event also covered high-reliability market segments such as defense, automotive, med- ical, and data infrastruc- ture, which are central to Europe's electronics man- ufacturing industry. Alison James, senior director, Europe, said the event was "a wonderful example of cooperation between the public and private sectors on the im- portant topic of defence. In a new geopoliticial land- scape, this will become increasingly important. There is critical work to be done in the EU." Electronics in Space T H E G L O B A L R E P O R T Subscribe! Stay up-to-date on the latest news and insights on advanced electronics packaging! Subscribe here to the I-Connect007 Advanced Electronics Packaging Digest, a monthly email to your inbox. Read the latest issue here.

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