IPC International Community magazine an association member publication
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9 8 C O M M U N I T Y M A G A Z I N E FA L L 2 0 2 5 B I T S & B Y T E S APEX EXPO 2026, the Global Electronics Associa- tion's flagship event for the electronics industry, is scheduled for March 14–17, 2026, at the Anaheim Con- vention Center in Anaheim, California. This event is for OEMs, EMS providers, PCB manu- facturers, and industry professionals from around the globe who come together to access the latest tech- nical content, contribute to standards development, and network with the industry's largest gathering of capital equipment manufacturers, suppliers, and product innovators in design, printed board manu- facturing, electronics assembly, and test. What to Expect? The Technical Conference has been renamed: Ad- vanced Electronic Packaging Conference 2026 Component- to System-Level Integration. The name reflects a strategic evolution of the growing conver- gence of packaging, interconnect, and manufacturing technologies at every level of integration. "While the format and scope of the conference are being transformed, the technical content our industry relies on is not only being preserved—it's being expanded to better reflect today's full com- ponent-to-system-level view," says Stanton Rak, co- chair of the Technical Program Committee. Get the details here. The Learning Lounge, a workforce training and cer- tification track on the show floor, is also returning. Professionals, educators, trainers, and industry lead- ers are invited to submit presentation proposals that focus on the strategies, tools, and best practices that support training, certification, and workforce devel- opment in the electronics manufacturing industry. The deadline to submit a proposal is Dec. 10, 2025. Get the details here. Get Ready to Be Transformed at APEX EXPO 2026