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82 SMT007 MAGAZINE I NOVEMBER 2025 K N O C K I N G D OW N T H E B O N E P I L E Solderability Test Methods, Myths, and Realities Solderability testing answers a simple question: How readily will a termination form a sound sol- der joint under defined conditions? It is not com- ponent preconditioning. Rather, it evaluates wet- ting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual "dip-and-look" or wetting-bal- ance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use. Because lead-free alloys wet differently than SnPb, the same part can exhibit noticeably different solderability depending on the alloy and process conditions. Why Test Solderability? Solderability testing verifies that device termina- tions (and other solderable surfaces) will achieve by Nash B ell, BEST, Inc. the degree of wetting needed for a robust, reliable joint with either SnPb or Pb-free alloys. It's used to: • Qualify and compare finishes, fluxes, pastes, and alloys, and screen incoming components • Monitor aging and shelf life, catching oxidation or contamination before it reaches the line • Support PCB manufacturing and assembly process control, including evaluation of board finishes and coatings Weak solderability results signal risk—slow or incomplete wetting, non-wetting/de-wetting, higher rework, and field-reliability concerns—prompting corrective actions before volume build. Qualitative vs. Quantitative Solderability testing evaluates how readily molten