NOVEMBER 2025 I DESIGN007 MAGAZINE 43
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F o r t h e l a t e s t n e w s a n d i n f o r m a t i o n , v i s i t I - C o n n e c t 0 0 7. c o m
Designers Notebook:
Power and Ground
Distribution Basics
The principal objectives to be established
during the planning stage are to define
the interrelationship between all compo-
nent elements, confirm that there is suffi-
cient surface area for placement, ensure
the space needed for efficient circuit
interconnect, and accommodate ade-
quate power and ground distribution.
ASC Sunstone Circuits Adds
New Options to OneQuote While
Maintaining Real-Time Pricing on
Core PCB Features
ASC Sunstone Circuits, a leading U.S. PCB manufacturer,
announced a significant expansion of its OneQuote online
quoting tool, giving design engineers more control over
complex PCB configurations—making it easier for the quote
team to quickly clarify and verify specifications, reducing
delays from manual quote reviews.
Elementary, Mr. Watson:
Heat—The Hidden Villain
of Power Electronics
If electricity were a group of college
students, then power electronics and
the PCB designers who dive into it
would insist on driving the car on every
road trip because they know the car
inside and out—they're the students
with jumper cables in the trunk, a tire
pressure gauge in the glove box, and
snacks stashed under the seat.
Fresh PCB Concepts: Resilience
and Renewal in Domestic PCB
Manufacturing
As veterans of PCB manufacturing, we have spent much
of our careers walking factory floors, examining copper cir-
cuits under microscopes, and troubleshooting plating lines
when they go awry at 2 a.m. We can say with confidence
that PCBs are the unsung heroes of modern life. They're in
everything, from tooth-
brushes and thermo-
stats to satellites and
defense systems.
The Latest Issue: Advanced Electronics Packaging Digest to
Explore Critical Minerals, Substrates, and Reliability Standards
Driving Next-Gen Electronics
I-Connect007 is pleased to announce the latest issue
of Advanced Electronics Packaging Digest (AEPD) on
October 13, 2025, featuring expert insights on the technol-
ogies shaping the future of advanced packaging.
