Issue link: https://iconnect007.uberflip.com/i/1541367
34 PCB007 MAGAZINE I NOVEMBER 2025 D R I V I N G I N N OVAT I O N by Simon K hesin, S chmoll Maschinen During the creation of a multilayer board, the lam- ination process naturally results in excess resin (known as "flash)" being squeezed out and solidified along the sides of the PCB panel. While the consis- tency and size of this flash provide process engi- neers with valuable insight into lamination param- eters, the flash itself must be completely removed before subsequent manufacturing steps. The Flash Cutting Process The panel edge shape and quality are often over- looked, but can directly influence final product yield and operational safety: • Equipment protection: A sharp, uneven, or burred panel edge can damage the lamina- tion rollers of expensive equipment, such as dry film laminators, leading to significan maintenance costs and downtime. • Plating contamination: Edges with burrs can lead to contamination during the plat- ing process. These small, unse- cured particles of copper or resin can disconnect and fall into the plating solution, potentially leading to improper plating parameters and bath contamination. • Fiducial accuracy: If subse- quent processes rely on the position of fiducials according to the panel edge, any resid- ual flash or rough contour might affect the positioning during subsequent processes. • Operator safety: Sharp edges pose a direct physical hazard, risking injury to oper- ators during manual handling steps. Therefore, the methodical elimination of flash and the precise forming of the panel edge after lamination are important steps for manu- facturers focusing on quality and stable production. ▼ F i g u re 1 : M u l t i l aye r p a n e l b efo re f l a s h re m ova l .