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52 SMT007 MAGAZINE I DECEMBER 2025 Conclusion: Driving Sustainability and Reliability with Multicomponent LTS Alloys As sustainability pressures intensify across the automotive sector, manufacturers are seeking materials and processes that align with carbon reduction goals without compromising reliability. Multicomponent LTS alloys offer a proven solution for interior and off-the-bonnet applications, where operating temperatures remain below 100°C. These alloys reduce thermal stress, support long-term durability, and enable significant energy savings, helping automotive OEM designers meet environmental targets while maintaining product integrity. For circuit board assemblers, the transition from SAC alloys to advanced multicomponent low-tem- perature solder formulations represents a stra- tegic shift. Lower reflow temperatures reduce equipment wear, energy consumption, and CO₂ emissions per unit produced. Modern zero-halogen, low-temperature flux chemistries, combined with lead-free, LTS alloys, deliver mechanical performance while aligning sustainability goals with the evolving demands of circuit board assembly. This enables assemblers to meet evolving reg- ulatory standards and sustainability certifications, while optimizing process efficiency and cost-effec- tiveness. These developments position LTS from a niche option to a strategic choice⁹ for the elec- tronics industry. Adopting this technology means initiating a broader shift toward sustainable innova- tion, improving operational efficiency, and product performance. This presents a real opportunity that offers a measurable benefit for both manufacturers and the planet. References 1. 2023 Stellantis Corporate Social Responsibility Report. 2. "BYD Releases 2024 ESG Report," Telematics Wire. 3. Volkswagen Group Annual Report 2024: "Resource use and circular economy." 4. "Stellantis Fosters Circular Economy Ambitions with Dedicated Business Unit to Power New Era of Sustainable Manufacturing and Consumption," Stellantis, Oct. 11, 2022. 5. SAC 205, MacDermid Alpha Electronics Solutions. 6. "Price volatility may rise in fragmented indium market," Argus Metals, April 10, 2025. 7. CIRC-UITS Project, funded by the European Union's Horizon Europe program, aims to enhance sustainability and circularity in the European electronics components industry, particularly within the automotive and mass elec- tronics sectors. 8. "Off-the-bonnet" applications refer to electronics systems and components that are not located under the vehicle's hood (bonnet), meaning they are positioned else- where in the vehicle, typically in the cabin or body, where thermal demands are typically lower. 9. "Applications and Recent Advances of Low-Temperature Multicomponent Solders in Electronic Packaging: A Re- view," by G. Wu, J. Shen, D. Zhou, M.K. Faiz, and Y.H. Wong, Micromachines, 2025. Daniele Perico is an account manager for MacDermid Alpha Electronics Solutions.