Issue link: https://iconnect007.uberflip.com/i/1541985
16 PCB007 MAGAZINE I DECEMBER 2025 Why are Henger's plasma sys- tems valuable tools for AI hardware manufacturing? Li: Our AI-focused plasma etching and cleaning system has three major upgrades tailored to manu- facture with next-generation AI PCB materials: 1. Precision control of electrode tempera- tures. By accurately monitoring each elec- trode plate's temperature, we achieve stable etching rates and exceptional uniformity. This makes the system compatible with higher- grade materials (high-filler content, new resin systems) and provides long-term process adaptability for future PCB production lines. 2. Real-time monitoring of RF open-circuit conditions. Detecting RF opens on each electrode prevents etching non-uniformity. In addition, we've optimized plasma density distribution—transitioning electrode struc- tures from rectangular to arc-shaped—signifi- cantly reducing edge-field concentration and improving etching consistency between the edges and center of large AI panels. 3. Improved uniformity inside high aspect- ratio holes. We upgraded the vacuum cham- ber structure by reducing thermocouple (TC) sensor perforations and improving sealing, and shifted from "distributed temperature sensors" to a "dense sensor array," greatly reducing deformation and leakage risks. This ensures stable vacuum levels during long-term processing and enhances etching repeatability. What new challenges does AI impose on PCB manufacturing? How does Henger's plasma tech- nology address these pain points? Li: The reliable manufacturing of advanced PCBs— especially those using materials like M8, M9, EM892K2, EM896K3, TU943, and other next- generation high-performance laminates—is becom- ing indispensable. Plasma technology plays a key role in several critical processes: Desmear and Activation of Hole Walls • Challenge: During drilling, especially laser drilling, epoxy residues (smear) can remain on the hole wall, preventing electroless copper from bonding properly and causing open circuits or reliability issues. • Plasma solution: Plasma precisely and uni- formly removes or desmears organic resi- dues and activates the surface, transform- ing it from hydrophobic to hydrophilic. This greatly enhances chemical copper adhesion and uniformity. • Industry driver: As multilayer counts increase and hole diameters shrink, high-quality desmear becomes even more essential. Increasing Surface Roughness for Better Adhesion • Challenge: Next-generation PCB materi- als for high-speed signals (low-Dk/Df resins, PTFE, modified epoxies) have extremely smooth, chemically inert surfaces, making it difficult for dry films or solder masks to adhere.