Issue link: https://iconnect007.uberflip.com/i/1541985
46 PCB007 MAGAZINE I DECEMBER 2025 Lengthy changeover times were another draw- back, as switching between jobs necessitated changing screens or films, which contributed to downtime and lower productivity. The process presented waste management challenges, because it involved phototool films and solvents, and the release of volatile organic compounds during curing. Additional operational challenges included cleaning chemicals, and high water and energy consumption. Serialization, which is essential in PCB manufac- turing, became a bottleneck in the solder mask printing process. It required complex CAM data preparation, with hours of engineering time spent preparing artwork and tools, resulting in additional material costs with zero flexibility, as changes to this process were iterative. These limitations not only affected yield but also made the process inflexible for small batches and high-mix production environments. Finally, when it came to thick copper panels, traditional solder mask application methods often caused production and quality problems, leading to uncovered valleys, exposed copper edges, and uneven solder mask layers. To address this, opera- tors had to apply excess solder mask, which slowed production and raised material costs. Achieving consistent coverage and precise alignment on these complex surfaces was challenging, resulting in ongoing quality issues, more rework, and higher overall production costs. The Solution: Orbotech Neos Inkjet Seeking a modern and efficient solution, the customer evaluated the Orbotech Neos™ inkjet system for solder mask application. Initial trials were successful, demonstrating the effective- ness of the new process. The transition required minimal changes to the production environment. Within a few weeks, the system was fully inte- grated into the customer's solder mask line. With digital direct printing, Neos eliminated the need for photo-tooling. Printing images directly from CAM data now reduces the number of process steps and the risk of alignment errors. Precision ink deposition yields accurate and consistent solder mask coverage. The system's integrated workflow automates everything from file prep- aration to alignment and printing, streamlining the entire process into a single digital step. The system's seamless process automation saves time by enhancing efficiency and reliability throughout the solder mask line (Figure 1.) After just a few months of operating the Neos system, the customer reported significant improve- ments across key performance indicators: Enhanced Operational Efficiency • Minimal setup time: Instant job-to-job changeovers thanks to the digital platform and intuitive interface. • Reduced cycle time: Solder mask applica- tion time is significantly reduced compared to the traditional process, with increased time savings for higher copper thicknesses. • Increased flexibility: Ability to handle more jobs per shift, including urgent or prototype batches, without slowing production. Improved Product Quality and Reliability • Higher print accuracy: Alignment issues were eliminated; consistent ink deposition across all board types. • Reduced defect count: Dramatic drop in defects due to bubbles, under- or over- curing and contamination. No solder mask overflow in holes and vias.