Issue link: https://iconnect007.uberflip.com/i/1541985
www.atotech.com Cuprapulse ® XP7-UA – Vertical reverse pulse plating with inert anodes for advanced package substrates MKS' Atotech introduces Cuprapulse ® XP7-UA, a vertical reverse pulse plating (RPP) process with inert anodes. It is designed for core plating of package substrates in applications involving AI, 5G, and high-performance computing (HPC). The process ensures exceptional copper thickness uniformity, high throwing power, and long-term bath stability, which are critical for advanced substrate manufacturing. It effectively reduces the surface thickness gap, a phenomenon where high hole density areas receive less copper plating thick- ness, while low hole density areas accumulate more. Why it matters Evolving package substrates demand precise copper thickness control across variable feature densities. Non-uniform plating can compromise impedance, via reliability, and signal integrity. Cuprapulse XP7-UA addresses these challenges with a vertical RPP process that delivers consistent deposition, even on panels with highly variable hole densities while keeping high throwing power. Technology overview Cuprapulse XP7-UA uses a reverse pulse waveform to optimize ion distribution, surface leveling, and uniform copper deposition. Inert anodes maintain stable anode and electrolyte conditions, preventing harmful by-products and ensuring consistent sur - face distribution. By eliminating anode dissolution, the process reduces maintenance requirements and enhances overall process stability. Process sequence The Cuprapulse XP7-UA system follows a streamlined sequence designed for optimal copper deposition. This configuration is fully compatible with up-to-date hoist-type vertical plating equipment, allowing straightforward implementation in existing production lines. Performance and benefits Cuprapulse XP7-UA delivers uniform copper thickness across varying hole densities in combination with superior throwing power in conformal through-hole deposition. Its capability to support higher current densities boosts productivity without sacrificing plating quality. The process leverages inert anodes and reverse pulse plating for stable plating environment, minimizing maintenance and improving productivity while increasing overall reliability. In comparison with conventional DC plating Compared to conventional DC plating, the reverse pulse technology improves ion replenishment and surface leveling, narrowing thickness variation. Eliminating anode dissolution variability enables more uniform copper plating and greater reliability for fine-feature, high-density designs. Applications and qualifications Cuprapulse XP7-UA is qualified by leading substrate manufac - turers and proven in production for AI, HPC, 5G applications, and advanced package substrates requiring precise copper uniformity. Its reverse pulse technology, inert anodes, and stable chemistry set a new standard for precise copper plating in advanced substrates. Henning Hübner Global Product Manager PP MKS' Atotech 0049.30.34 98 54 34 henning.huebner @ mks.com Parameter DC Plating Cuprapulse Improvement XP7-UA (RPP) Surface thickness variation ± 30 % ± 10 % (difficult design) Throwing power (16 : 1 via) 60 % > 95 % > 35 % Productivity 100 % > 160 % > 60 % Anode maintenance weekly yearly 52 x Applied current density (AR 16:1) < 1.5 A /dm² > 2 A /dm² > 25 % Process costs reduction* low high * plated Cu, Cu etching, solder mask thickness, waste water TH dense TH iso Surface Thickness Gap