JANUARY 2026 I I-CONNECT007 MAGAZINE 109
IPC-7530B, Guidelines for Temperature
Profiling for Mass Soldering Processes
(Reflow and Wave)
This document provides useful and practical infor-
mation for developing thermal profiles to produce
acceptable SnPb and Pb-free electronics assem-
blies using reflow, vapor phase, laser, selective,
and wave soldering equipment. The document also
includes a troubleshooting guide for addressing
common defects that can be attributed to profiling.
IPC-4556A, Specification for Electroless
Nickel/Electroless Palladium/Immersion
Gold (ENEPIG) Plating for Printed Boards
This performance specification sets the require-
ments for the use of Electroless Nickel/Electroless
Palladium/Immersion Gold (ENEPIG) as a surface
finish for printed boards. This performance spec-
ification defines ENEPIG deposit thicknesses for
applications including soldering, wire bonding, and
as a contact finish. It is intended for use by chem-
ical suppliers, printed board manufacturers, elec-
tronics manufacturing services (EMS), and original
equipment manufacturers (OEMs).
This standard may be used to specify accep-
tance criteria to meet performance requirements in
addition to those found in the IPC-6010 series (IPC-
6012, IPC-6013, and IPC-6018) of standards.
The ENEPIG deposit specified by using this doc-
ument will meet the highest coating durability rat-
ing as specified in the J-STD-003 printed board
solderability specification. This specification is
based on three critical factors:
1. The ENEPIG plating process is in control, pro-
ducing a normal distribution for nickel, palla-
dium, and gold deposit thickness.
2. That the tool used to measure deposit thick-
ness, and therefore control the process, is
accurate and reproducible for the thickness
ranges specified.
3. That the ENEPIG plating process results in
uniform deposit characteristics.
If any of these three critical factors are not met,
then the deposit produced will not meet the perfor-
mance criteria defined herein.
IPC/WHMA-A-620F,
Requirements and
Acceptance for
Cable and Wire
Harness Assemblies
IPC/WHMA-A-620 is the
only industry-consen-
sus standard for Require-
ments and Acceptance
of Cable and Wire Har-
ness Assemblies. IPC/
WHMA-A-620F describes
materials, methods, tests and acceptance criteria
for producing crimped, mechanically secured and
soldered interconnections and the related assem-
bly activities associated with cable and harness
assemblies.
IPC-T-50P, Terms and Definitions
for Interconnecting and Packaging
Electronic Circuits
This document is designed to provide definitions
for terms commonly used in the electronics indus-
try. The definitions are intended to provide suffi-
cient clarity of detail such that a reader utilizing
English as a second language could understand
the subtleties of the meaning. Revision P contains
over 120 new or revised terms, including new ter-
minology for back-drill structures, cable and wire
harnesses, board packaging, sintered intercon-
nects, soldering, fabrication processes, and testing.
IPC-9271, Guidelines for In System
Programming
IPC-9271 provides guidelines for device-level In-
System Programming (ISP) as part of the electron-
ics assembly process. The standard addresses
PCB design for ISP, fundamental characteristics
when selecting an ISP programmer, and the inte-
gration of the programmer in the production envi-
ronment, including fixtures, software, mechanical,
and process integration methodologies to increase
efficiency, which reduces programming costs and
improves productivity and quality in the production
environment. I-CONNECT007
