I-Connect007 Magazine

126 I-CONNECT007 MAGAZINE I JANUARY 2026 EDUCATIONAL RESOURCES Encapsulating Sustainability for Electronics by Beth Turner, MacDermid Alpha Electronics Solutions This book discusses the growing demand for sustainable solutions in the market and highlights examples of bio-based resins and the demand from emerging technologies. Read it now! DFM Essentials by Anaya Vardya, American Standard Circuits, ASC Sunstone Circuits One of the biggest challenges facing printed circuit board designers is not understanding the cost drivers in the PCB manufacturing process, particularly the manufacturing of advanced technology PCBs. The guidelines offered in this book are based on both ASC recommendations and IPC standards. Download your copy today.

• I-Connect007 Magazine — January 2026
• From Silos to Systems: 2026 and Beyond — Design007 Content
• PCB007 Contents
• Marcy's Musings: Setting the Pace for an Industry in Motion by Marcy LaRont
• A Look Back at 2025 as an Inflection Point by Nolan Johnson
• I-Connect007 2025 Editor's Picks
• Target Condition: Adaptation Is the New AI Advantage by Kelly Dack
• Design Village: Bringing the Design Community Front and Center with Peter Tranitz
• What Makes Modern PCB Design So Difficult by Stephen V. Chavez
• Beyond IPC-2152 by Mike Jouppi
• Elementary, Mr. Watson: Where the PCB Ends and Advanced Packaging Begins by John Watson
• Short: What It Will Take to Modernize Defense Solder Standards with Denny Fritz
• Connect the Dots: The Future of Designing for Reality—Pattern Plating by Matt Stevenson
• Designing for Reliability: Why Understanding Materials, Cleanliness, and Lifecycle Matters More Than Ever with Tibi Baranyi
• The Evolution of PCB Design from 2D Layouts to 3D Structures with Kris Moyer
• Performance-enhancing Benefits of Flexible Circuit Technology by Joe Fjelstad
• Quantum Sensing: Four Bars on Mars
• PCB Design in 2026 and Beyond by Filbert Arzola
• Proper Plane Design Techniques by Kris Moyer
• The Pulse: Ultra-high Stakes—Will UHDI Enter the Mainstream for Low- and Mid-Volume? By Martyn Gaudion
• MilAero Highlights
• What's Next In PCB Fabrication with Gene Weiner
• The Chemical Connection: Changes and Challenges Ahead in PCB Fabrication by Don Ball
• Normalizing the Impossible: The Next Era of PCB Fabrication with Sunny Patel
• Happy's Tech Talk #46: Data Management for AI and Automation by Happy Holden
• High-Tech Hill in Lithuania with Vytautus Ilgunas
• American Made Advocacy: How Congress Can Restore the U.S. PCB Industry by Shane Whiteside
• Powering the Future: The Materials That Make Tomorrow Possible by Brian Buyea
• New IPC Standards Released by Global Electronics Association
• Driving Innovation: People Driving Precision in PCB Processes by Simon Khesin
• From Ham Radio to Hall of Fame Stories with Dan Feinberg
• Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1 by Anaya Vardya
• The Right Approach: Reflections on 50 Years in the Business, Part 1 by Steve Williams
• Career Opportunities—jobConnect007
• Educational Resources
• Probems Solved —Subscribe to Our Magazines