IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1542698
4 I-CONNECT007 MAGAZINE I JANUARY 2026 Marcy 's Musings: Setting the Pace for an Industry in Motion by Marcy LaRont A Look Back at 2025 as an Inflection Point by Nolan Johnson I- Connect007 2025 Editor's Picks New IPC Standards Released by Global Electronics Association 8 12 20 110 From Silos to Systems: 2026 and Beyond 22 32 42 58 70 78 54 74 28 36 48 Features Target Condition: Adaptation Is the New AI Advantage by Kelly Dack What Makes Modern PCB Design So Difficult by Stephen V. Chavez Elementary, Mr. Watson: Where the PCB Ends and Advanced Packaging Begins by John Watson The Evolution of PCB Design from 2D Layouts to 3D Structures with Kris Moyer PCB Design in 2026 and Beyond by Filbert Arzola The Pulse: Ultra-high Stakes—Will UHDI Enter the Mainstream for Low- and Mid-volume? by Martyn Gaudion Interviews Designing for Reliability: Why Understanding Materials, Cleanliness, and Lifecycle Matters More Than Ever with Tibi Baranyi Proper Plane Design Techniques by Kris Moyer Articles Design Village: Bringing the Design Community Front and Center with Peter Tranitz Beyond IPC-2152 by Mike Jouppi Columns Connect the Dots: The Future of Designing for Reality—Pattern Plating by Matt Stevenson JANUARY 2026 Design and fabrication have always been closely connected, but the rising demands for reliability, performance, and cost efficiency now require a closer alignment than ever before. The new I-Connect007 Magazine brings all of the pieces together for a more integrated electronics manufacturing landscape. I- Connect007 Features