IPC International Community magazine an association member publication
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42 I-CONNECT007 MAGAZINE I JANUARY 2026 Where the PCB Ends and Advanced Packaging Begins Change sits at the center of almost everything in PCB design. From the earliest days of printed cir- cuits to today's highly integrated electronic sys- tems, stability does not define this discipline; evolu- tion does. Materials change, component geometries shrink, signal speeds increase, and manufacturing processes advance. With each shift, we reshape the role of the PCB designer, sometimes quietly, and other times in a way that feels like a freight train driving through your living room. PCB design is unique because changes rarely occur in isolation. A new component package doesn't just alter a footprint; it affects routing strat- egies, layer usage, escape planning, and assem- bly considerations. Higher data rates don't just demand faster signals; they require tighter con- trol of impedance, loss, and reference structures. Increased power density introduces cascading thermal and reliability challenges that extend well beyond simple copper width calculations. Each advancement ripples across the entire design pro- cess, forcing designers to revisit assumptions and practices that may have held for years. Adapting is no longer optional for a designer who wants to remain relevant and practical. E L E M E N TA RY M R . WAT S O N F e a t u re C o l u m n BY J O H N WAT S O N , PA LO M A R C O L L EG E