IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1542698
48 I-CONNECT007 MAGAZINE I JANUARY 2026 The Future of Designing for Reality: PATTERN PLATING C O N N ECT T H E D OT S BY M AT T S T E V E N S O N , A S C S U N STO N E Last month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome. Design Considerations and Challenges Pattern plating, especially in UHDI PCBs, requires a design that creates uniformity and delivers pre- cision at the microscopic level. Pattern plating requires extra manufacturing steps that increase complexity. If designers and their manufacturing partners do not work closely, errors can drive up