I-Connect007 Magazine

6 I-CONNECT007 MAGAZINE I JANUARY 2026 84 88 92 62 102 114 96 106 110 116 Shorts What It Will Take to Modernize Defense Solder Standards with Denny Fritz Quantum Sensing: Four Bars on Mars Chung-Ang University Researchers Develop Interlayer Material for Lithium- sulfur Batteries Powering the Future: The Materials That Make Tomorrow Possible by Brian Buyea Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1 by Anaya Vardya In Every Issue MilAero007 Highlights Career Opportunities Educational Resources Advertiser Index JANUARY 2026 Features What's Next in PCB Fabrication with Gene Weiner The Chemical Connection: Changes and Challenges Ahead in PCB Fabrication by Don Ball Normalizing the Impossible: The Next Era of PCB Fabrication with Sunny Patel Article Performance-enhancing Benefits of Flexible Circuit Technology by Joe Fjelstad Interviews High-Tech Hill in Lithuania with Vy tautus Ilgunas From Ham Radio to Hall of Fame Stories with Dan Feinberg Columns Happy's Tech Talk #46: Data Management for AI and Automation by Happy Holden American Made Advocacy: How Congress Can Restore the U.S. PCB Industry by Shane Whiteside Driving Innovation: People Driving Precision in PCB Processes by Simon Khesin The Right Approach: Reflections on 50 Years in the Business, Part 1 by Steve Williams 46 69 95 107 115 82 120 126 127

• I-Connect007 Magazine — January 2026
• From Silos to Systems: 2026 and Beyond — Design007 Content
• PCB007 Contents
• Marcy's Musings: Setting the Pace for an Industry in Motion by Marcy LaRont
• A Look Back at 2025 as an Inflection Point by Nolan Johnson
• I-Connect007 2025 Editor's Picks
• Target Condition: Adaptation Is the New AI Advantage by Kelly Dack
• Design Village: Bringing the Design Community Front and Center with Peter Tranitz
• What Makes Modern PCB Design So Difficult by Stephen V. Chavez
• Beyond IPC-2152 by Mike Jouppi
• Elementary, Mr. Watson: Where the PCB Ends and Advanced Packaging Begins by John Watson
• Short: What It Will Take to Modernize Defense Solder Standards with Denny Fritz
• Connect the Dots: The Future of Designing for Reality—Pattern Plating by Matt Stevenson
• Designing for Reliability: Why Understanding Materials, Cleanliness, and Lifecycle Matters More Than Ever with Tibi Baranyi
• The Evolution of PCB Design from 2D Layouts to 3D Structures with Kris Moyer
• Performance-enhancing Benefits of Flexible Circuit Technology by Joe Fjelstad
• Quantum Sensing: Four Bars on Mars
• PCB Design in 2026 and Beyond by Filbert Arzola
• Proper Plane Design Techniques by Kris Moyer
• The Pulse: Ultra-high Stakes—Will UHDI Enter the Mainstream for Low- and Mid-Volume? By Martyn Gaudion
• MilAero Highlights
• What's Next In PCB Fabrication with Gene Weiner
• The Chemical Connection: Changes and Challenges Ahead in PCB Fabrication by Don Ball
• Normalizing the Impossible: The Next Era of PCB Fabrication with Sunny Patel
• Happy's Tech Talk #46: Data Management for AI and Automation by Happy Holden
• High-Tech Hill in Lithuania with Vytautus Ilgunas
• American Made Advocacy: How Congress Can Restore the U.S. PCB Industry by Shane Whiteside
• Powering the Future: The Materials That Make Tomorrow Possible by Brian Buyea
• New IPC Standards Released by Global Electronics Association
• Driving Innovation: People Driving Precision in PCB Processes by Simon Khesin
• From Ham Radio to Hall of Fame Stories with Dan Feinberg
• Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1 by Anaya Vardya
• The Right Approach: Reflections on 50 Years in the Business, Part 1 by Steve Williams
• Career Opportunities—jobConnect007
• Educational Resources
• Probems Solved —Subscribe to Our Magazines