IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1542698
86 I-CONNECT007 MAGAZINE I JANUARY 2026 analytics. There will be fully integrated digital work- flows from design to manufacturing to test to trace- ability. Product reliability and cost considerations will demand it. We will see standards like IPC-2581, additive/co-design tools. MES (manufacturing execu- tion system) integration will become mandatory. Gerber data will become a thing of the past. From a technological and manufacturing pro- cesses standpoint, and considering the rapid advancements in technology, what are the most significant challenges in PCB fabrication? There are a number of issues. For business own- ers, selecting which "new" process to invest in is a tremendous challenge. I see the creation and adoption of glass-based (not fiberglass) substrates on a broad scale. It presents significant processing challenges, including overcoming feasibility issues related to through-substrate glass. Another significant challenge is establishing large- format substrate processes and the materials to support that. Finally, as additive processes with ABF and its replacements become more commonly used by both chipmakers and board fabricators, it will become essential to establish common standards for UHDI. What are the most difficult challenges from a business operations perspective? In the U.S., a significant challenge is dealing with government officials, many of whom do not under- stand our industry (or have any interest) or its importance to everyday life, and then motivating them to create incentives that remove unnecessary roadblocks to establishing the necessary business ventures that will lead to greater independence and ultimate success. One Congresswoman flat- out told an associate of mine that she had no inter- est in our industry and was only concerned with passing social programs. Another major obstacle to overcome is the short- age of skilled and semi-skilled workers. Adequately addressing and solving this issue requires the education and cooperation of school boards, part- nerships between corporations and academia, and the recent progress made by government and trade associations. Gene, you are still present at various confer- ences. How are you engaging in advanced pack- aging? I am tracking new innovations for fabrication and assembly, including equipment, processes, and materials for advanced packaging. I am helping several companies in the U.S. and abroad deter- mine how to reach commercial viability and help- ing them get there. Other than your speaking engagements, in what other ways do you get important information out to the industry? I post some key things on my LinkedIn. I have been fortunate to develop over 14,000 followers, so I encourage your readers to check it out. Based on your experience, what is the most important thing people working in our field can or should be doing to remain valuable in their careers? You must learn to properly use AI to improve your own performance, and, always, you must continue to develop new skills. You will only remain valuable in any job if you continue learning and improving. PCB007 Gene Weiner