IPC International Community magazine an association member publication
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FEBRUARY 2026 I I-CONNECT007 MAGAZINE 47 Founded in 1990, ISO-certified, ITAR compliant, and US-based–Remtec offers advanced and high-performance ceramic packaging technology, substrates, circuit boards, and assembly components utilized across the electronics industry, especially in high-power, high-circuit-density, and mission-critical applications. Metallized Ceramics Offer Thermal Conductivity That Exceeds PCBs Metallized ceramic substrates (e.g., alumina, aluminum nitride, silicon nitride, diamond) conduct heat orders of magnitude (up to 300x) more efficiently than standard PCB materials, which enables rapid heat spreading and dissi- pation directly away from high-power devices. The resulting lower temperatures reduce ther- mal stress on adjacent components, improve performance stability, and significantly extend component and system lifespan, especially in power electronics, RF applications, and harsh environments. Ceramics Offer Superior Isolation and High Dielectric Strength Ceramic materials offer excellent electrical insulation, while supporting high voltages and dense conductor layouts. This, in turn, allows high-voltage and high-power circuits to coex- ist in compact footprints with reduced risk of arcing, leakage, or physical deterioration/ breakdown, which is critical for today's power converters, electric vehicles/charging, aero- space systems, and many high-power but com- pact medical applications. Ceramics Technologies Can Provide Impressive CTE Advantages With ceramic circuits and packages, coefficients of thermal expansion (CTE) more closely match those of silicon and wide-bandgap semiconduc- tors (e.g., SiC and GaN), unlike standard FR-4 PCBs. 1 2 3 4 5 During thermal cycling, this CTE compatibility reduces thermo-mechanical stress at critical interfaces—like die attachments, solder joints, wire bonds, and overall metallization—which minimizes risks of cracking, delamination, and fatigue. Combined with ceramic's inherent stability, this means higher reliability for high- power, high-temperature, and long-life systems operating in demanding environments. Metallized Ceramics Also Offer Versa- tility and Integration Opportunities Ceramic technologies support a wide range of configurations, including: simple substrates and circuits boards; high-density multilayer and hybrid structures; embedded passives, which can eliminate SMTs; leaded or leadless configurations; and even hermetical sealing to help withstand harsh environments. As such, designers gain freedom to optimize electrical, thermal, and mechanical performance simul- taneously—often consolidating what would be multiple PCB assemblies into a single, rugged- ized solution. Ceramics are Suitable as Chip Carriers and Leadless SMT Packages Modern metallized ceramics can be configured in a wide range of chip carriers and leadless SMT packages, making this material an attrac- tive option for today's optoelectronics, sensors, RF, and other precision microdevice applica- tions. Such packages also minimize parasitics, enhance thermal handling, reduce footprints, and provide hermetic or non-hermetic options tailored to demanding application requirements.