IPC International Community magazine an association member publication
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info @ atotech.com www.atotech.com Gold plating solution – Green, universal, economical To find out more about Aurotech ® G-Bond 3, scan the QR-code to the right. To find out more about Aurotech ® G-Bond 3, scan the QR-code to the right. Aurotech ® G-Bond 3 – Our new mixed reac on gold for ENIG, ENEPIG, and EPAG with non-toxic stabiliza on Reaching your sustainability goals while enjoying safer and more cost-effective PCB production is easier than ever with our new Aurotech ® G-Bond 3. As our latest generation gold electrolyte solution, it fulfils all industry standards for ENIG, ENEPIG, and EPAG plating. Among many other benefits, is non-toxic stabili- zation, meaning no handling of KCN replenishment is required. Its autocatalytic properties reduce the risk of a corrosive attack on nickel surfaces, thus fulfilling the latest industry regulations. Aurotech ® G-Bond 3 enables the deposit of a high gold layer thickness on nickel and palladium, with an excellent thickness dis- tribution of < 5% COV. Operating at a low gold content of 0.6 g/l with its inherent lower make-up and drag- out costs combined with the ability to target lower gold deposit thicknesses means our new gold electrolyte with autocatalytic properties offers real cost benefits during production for all types of gold containing final finishes.