Low-temperature reflow
to help eliminate HIP &
bridging on large size BGAs
Enhanced thermal cycle
reliability in harsh conditions
Reflow temperature
205–260°C
Enhanced thermal
cycling performance
Superior voiding
performance
Reflow temperature
235–260°C
INDIUM12.9HF
OF
NEXT
SOLDER
EVOLUTION
THE
indium.com
©2026 Indium Corporation
Engineered for fine-pitch
assemblies, delivering
high transfer efficiency &
superior SPI yields
High oxidation resistance
to eliminate graping in air
reflow
Low BGA, CSP, LGA,
and QFN voiding
