IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1544975
16 I-CONNECT007 MAGAZINE I MAY 2026 F E AT U R E I N T E RV I E W A dditive manufacturing has long promised to reshape how electronics are built, but that promise has remained just out of reach for many in the PCB industry who are limited by materials, performance trade-offs, and real-world manufacturability. Electroninks aims to change that equation by rethinking metallization at the chemical level by developing metal-complex inks that challenge established approaches and open new possibilities for advanced packaging, inter- connects, and beyond. Co-founder and President Melbs LeMieux discusses the evolution of the technology, the realities of bringing new materials to market, and where additive manufacturing may finally begin to deliver on its potential. Marcy LaRont: Melbs, please tell us a little bit about yourself and how Electroninks got started. Melbs LeMieux: I grew up in Michigan and later earned my PhD in Materials Science from Iowa State, followed by a postdoc in chemical engineer- ing at Stanford. Around 2013, I connected with our co-founder and CEO, Brett Walker. He was bring- ing some really strong chemistry to the table, and Rewriting Metallization ONE INK AT A TIME BY M A RCY L A RO N T, I - C O N N ECT 0 07 This simplified illustration depicts printing, sintering processes for both types of ink, possible problems that may arise during printing (nozzle clogging of particle ink), and sintering (substrate degeneration upon sintering at high temperature for particle ink).