IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1544975
44 I-CONNECT007 MAGAZINE I MAY 2026 Inline Optical Quality Control (IOQC) for Closed-loop Process Stability Inline optical quality control (IOQC) complements next-generation flash plating by adding objective, image-based verification of panel condition be- fore and after critical steps. High-resolution inline inspection can flag and empower the prediction of surface anomalies and handling-related de- fects (e.g., scratches, clamp/edge marks, localized stains, or particle-related artifacts) early enough to prevent yield loss downstream. When linked to product traceability, IOQC en- ables trend monitoring across lots and supports faster root-cause analysis by correlating visual sig- natures with process conditions (transport, filtration performance, and local uniformity effects). Used as a "digital layer" around the plating module, IOQC strengthens process robustness by turning sporadic defects into measurable signals that can be acted on promptly, supporting stable high-yield manufacturing in advanced HDI and mSAP production. As HDI designs advance, particularly with mSAP, inner layer thicknesses are dropping to 30–50 µm, and in leading-edge cases to ≤25 µm. Combined with thin copper-clad, this creates growing chal- lenges for horizontal transport. To address this, specialized guiding zones were added at the plating unit's inlet and outlet to ensure stable and reliable panel handling. Compact, Energy-efficient System Design To support sustainable production, the plating unit was redesigned to reduce material use and improve energy efficiency. A lower housing height decreases material consumption while improving maintenance access. A more compact internal layout cuts electrolyte volume by 24%, reducing both heating demand and holding tank capacity, and enhancing overall environmental and op- erational efficiency. These improvements reduce energy, water, and chemical consumption while simplifying maintenance. Results of the Upgraded System The upgraded flash plating system underwent extensive evaluation, comparing its copper deposi- tion performance to the previous Process of Record (POR). The goal was to improve copper's physical properties while preserving the POR's strengths, in- cluding BMV reliability and wet in wet compatibility. The upgrade focused on three key objectives: • Improved material performance through better copper uniformity, grain structure, and adhesion for higher interconnect reliability. • Greater process efficiency by lowering chemical consumption, shortening process times, and enhancing bath stability. • Maintain BMV integrity, ensuring strong cop- per fill and leveling for robust mechanical performance. Initial results show that the upgraded system not only meets but surpasses the previous POR, delivering a more cost effective and technically advanced solution for high density interconnect manufacturing. Figure 2: Precision transport for ultra-thin cores. MKS CONFIDENTIAL 1 Diagram for the article Inline Optical Quality Control (IOQC) FOR INTERNAL USE ONLY! Continuous image acquisition enables real-time quality monitoring . 1 XX Edge analyticsmodels generate insights and panel overview . 2 Process deviation alertsflag deviations beyond defined thresholds 3 Traceability enables manual inspection and correlation with process conditions 4 Closed-loop control support for targeted process adjustments 5 Result: Quality deviations are detected early and mitigated through targeted data-driven process adjustments. Sync IOQC IIoT (e.g. DFS) SCADA (e.g. VCS) Traceability Process Specific Models Image Acquisition Edge Analytics Models Process Deviation Alerts Process Engineer Process Qualification Process Control 1 2 3 4 5 Runtime Process Tuning Panel Overview Insights (e.g. Surface anomalies, Clamp-area defects) Figure 3: Improvement of new copper plating line: New vs. old.