IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1546209
4 I-CONNECT007 MAGAZINE I AUGUST 2026 From Ecosystems to Innovation The industry's toughest challenges can't be solved in isolation. This issue explores how co-design, advanced PCB fabrication, AI infrastructure, materials selection, and flexible circuits create stronger products and better outcomes. From intelligent data transfer and HDI advancements to AI data centers and robotics, experts help us understand that better products begin with broader collaboration. From The Editor Marcy's Musings 8 The Power of the Electronics Ecosystem by Marcy LaRont Features Target Condition 12 Life in the Engineering Ecosystem by Kelly Dack Elementary, Mr. Watson 18 PCB Design Is a Team Sport (Revisited) by John Watson 26 Designing for a More 'Intelligent' and Connected Future with Kristin Moyer Flexible Thinking 32 Beyond DFM: PCB Design and Manufacturing as a Cooperative Effort by Joe Fjelstad 36 Who Really Designs the PCB? by Stephen V. Chavez Columns Flex Connections 22 Four Lessons in Engineering Judgment for PCB Designers by Dan Skweres Designer's Notebook 62 Implementing Strategic Planning Principles for PCB Design by Vern Solberg Connect the Dots 90 What PCB Designers Should Know About Materials by Matt Stevenson AUGUST 2026 SPECIAL SECTION ▼ Infographic: Anatomy of an AI Data Server 50 Powering AI: Inside TeraWulf's Lake Mariner Campus by Marcy LaRont 46 A Closer Look at AI Data Centers 45 The AI Data Center Boom: Technology, Capacity, and Society with Andrew Bradner 52