IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1546209
40 I-CONNECT007 MAGAZINE I AUGUST 2026 BY B R I A N B U Y E A , R E M T EC P OW E R I N G T H E F U T U R E If you ask 10 engineers what "assembly" means in electronics, you'll likely get 10 variations of the same answer: placing components on a board and soldering them down. That definition might work for traditional PCB-based electronics, but in high-pow- er, high-reliability systems, it falls short by a mile. Power module assembly is actually about building a system from the ground up, one that must handle heat, current, mechanical stress, and time without failure. When you're working with ceramic substrates and high-performance mate- rials, assembly becomes less of a step and more of a discipline. So, a power module assembly includes every- thing required to transform a bare substrate into a fully functioning, field-ready system—electrically, thermally, and mechanically integrated—and every step matters. From Substrate to System The Power Module Assembly SPOTLIGHT ON Assembly

