IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1546209
10 I-CONNECT007 MAGAZINE I AUGUST 2026 data centers. You'll find my special section on that visit in this issue, which I believe demonstrates how relevant AI data centers are to our professional and personal lives. I'd love to get your feedback via email or LinkedIn. Our PCB design expert contributors embraced this month's assignment, offering a range of insightful and often creative metaphors to describe the PCB design ecosystem. From critters in the forest to a failed baton handoff in the 2020 Olympics, and even a drum major in a parade, we gain a clearer picture of the importance of an ecosystem, and find ourselves asking, "Why haven't we been doing this all along?" Stephen Chavez of Siemens declares that his greatest successes came when "every stakeholder became part of the design process instead of becoming a reviewer of completed work." However, Kristin Moyer raises some concerns about data security in fully cloud-based systems, especially when working in classified settings. Being fully inte- grated will require some essential protocols yet to be determined. In PCB fabrication, we revisit the idea of vertical conductive structures (VeCS), an alternate way to process HDI boards with very high layer counts and large form factors, using standard PCB processes and equipment. Joan Tourné of NextGin Tech- nology developed VeCS in partnership with Wus, and writes about its continued development with R-VeCS and X-VeCS. Given where we find ourselves with HDI and packaging challenges, this is worth another look. With a view toward advanced electronic pack- aging, Mike Carano explores pre-electroless causes of voids, which become far more likely with large motherboards and very high layer counts, as are popular in 2.5D and 3D heterogeneous integration. GreenSource Engineering shares preliminary results from a study on agitation and copper balancing to achieve more uniform copper plating across large panels. PCBAA is discussing the National Defense Authorization Act (NDAA) and the mandate from the U.S. government to soon disallow PCBs from China, Russia, Iran, and North Korea. There's a deadline coming up quickly for commentary that you don't want to miss. Finally, we focus on flex. I'm thrilled to have a new column from Flexible Circuit Technologies, kicked off by Dan Skweres, taking us through the familiar journey of "just because you can doesn't mean you should." Anaya Vardya of American Standard Circuits writes about the "cockroach" robot and how its "exoskeleton" is the flexible circuit itself. "The rigid-flex PCB that is simultaneously a skel- eton, nervous system, and muscle interface may prove to be one of the most consequential engi- neering innovations in small-scale robotics," he writes. Really fascinating stuff! I always enjoy putting together these issues at the confluence of legacy and innovation. Cherish these fleeting end-days of summer and take some time to enjoy reading through this month's maga- zine. I-CONNECT007 Marcy LaRont is the managing editor of I-Connect007 Magazine and executive director of IPC Publishing Group. Marcy started her career in PCBs in 1993 and brings a wide array of busi- ness experience and perspective to I-Connect007. To contact Marcy, click here. M A RCY 'S M U S I N G S