SMT007 Magazine

SMT007-Sep2026

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SEPTEMBER 2026 I SMT007 MAGAZINE 35 lead to soldering defects and reliability issues. Head-in-pillow and non-wet opens are two common warpage-induced defect types that are particularly challenging in AI server applications. As BGAs increase in size, they become increasingly susceptible to warpage during reflow, significantly increasing the risk of these defects. Durafuse®LT is particularly well suited to these challenges because it reflows at a lower temper- ature, approximately 20°C lower than SAC305. Reflowing at around 220°C rather than 240+°C significantly reduces component warpage and, consequently, the risk of head-in-pillow and non-wet open defects. It also provides a tough, ductile solder joint. Many traditional low-temperature alloys can be brittle, making them more susceptible to fracture from mechanical and thermal shock. Durafuse LT is designed to provide greater resistance to this type of brittle failure. Finally, the flux system is specifically engi- neered to help mitigate non-wet opens and head- in-pillow defects. By combining the advantages of this alloy with a purpose-designed flux system, we provide a robust solution for the demanding assembly challenges facing today's leading AI server manufacturers. Could having a local presence in the Mexican mar- ket influence some of your product development? We're the second-largest supplier of soldering materials in the Mexican market, giving us a strong presence and a deep understanding of our customers' needs. Establishing local manufacturing will bring us even closer to our customers, allowing us to provide faster, more responsive support and greater supply-chain flexibility. There are always inflection points in technology that create new chal- lenges and emerging needs. We embrace these challenges by developing innovative products that address technical gaps in the market. Thanks, Chris. You're welcome. SMT007 Durafuse® | Indium Corporation The new Indium Corporation manufacturing facility in Guadalajara, Mexico.

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