Issue link: https://iconnect007.uberflip.com/i/1546383
54 SMT007 MAGAZINE I SEPTEMBER 2026 T he ability to non-destructively inspect PCB assemblies is extremely important for veri- fying product quality without compromis- ing the assembly. X-ray inspection provides a non- destructive method for examining optically hidden features that cannot be evaluated using automated optical inspection (AOI) or microscopic inspection. This makes it particularly valuable for verifying solder joint interconnections beneath BGAs, chip- scale packages (CSPs), and other bottom-terminat- ed components. During X-ray inspection, electronic devices are exposed to ionizing radiation produced by high- energy photons and therefore receive a measur- able radiation dose. Most PCB assemblies can be inspected safely using normal X-ray practices. BY N AS H B E L L , B EST, I N C. Minimizing X-ray Dosage During PCB Inspection K N O C K I N G D OW N T H E B O N E P I L E