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62 SMT007 MAGAZINE I SEPTEMBER 2026 sample remains close to the X-ray source, the device does not receive the dose-rate reduction that would result from increasing its distance from the focal point. Dose estimates should therefore account for the actual sample position during oblique inspection. Minimizing Radiation Dosage A semiconductor device receives some radiation throughout the X-ray inspection sequence. However, the greatest portion of the total dose is typically received while the device is positioned close to the X-ray source for high-magnification inspection. Practical methods for reducing radiation dose include: • Increase the distance between the sample and the X-ray tube focal point whenever maxi- mum magnification is unnecessary • Inspect only the areas requiring examination • Limit extended exposure over radiation- sensitive components • Minimize inspection time through stan- dardized or automated inspection routines • Avoid unnecessary repeated inspection following rework or repair • Track the number of inspection cycles per- formed on sensitive assemblies • Measure actual dose using a chemilumi- nescent dosimeter when component sen- sitivity is a concern • Evaluate appropriate X-ray filtration for the specific equipment and inspection requirement K N O C K I N G D OW N T H E B O N E P I L E Figure 2: Comparison of tilting the sample and moving the detector to obtain an oblique-angle view.