IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1547121
OCTOBER 2026 I I-CONNECT007 MAGAZINE 15 About the Authors John T.C. Lee President and Chief Executive Officer, MKS John T.C. Lee leads leads the MKS global strategy and vision, guiding the company's role in enabling critical technologies that power next-generation innovation. His perspective spans the entire tech- nology ecosystem, from semiconductor manufac- turing and advanced electronics to industrial and AI-driven applications, providing a unique view of the market forces shaping the future. Won Lee Vice President, Power Solutions and Chief Technology Officer, Vacuum Solutions Division (VSD) Won Lee leads the Power Solutions Business Unit and technology strategy and innovation for the MKS Vacuum Solutions Division, with expertise spanning vacuum technologies, power solutions, and the critical subsystems that enable advanced semiconductor manufacturing. His insights focus on the infrastructure technologies required to support increasingly complex and performance-intensive AI device production. Marc Tricard Vice President and Chief Technology Officer, Photonics Solutions Division (PSD) Marc Tricard oversees technology innovation across across the MKS Photonics Solutions Division, including laser-based manufacturing, photonics, precision optics, and advanced process solutions. His perspective highlights how laser and photonics technologies accelerate semiconductor scaling, advanced packaging, and the high-performance computing systems that drive AI adoption. Kuldip Johal Chief Technology Officer and Vice President, Business Development, Materials Solutions Division (MSD) Kuldip Johal leads technology strategy and busi- ness development for the MKS Materials Solutions Division, focusing on advanced packaging, specialty chemistries and equipment, and interconnect solu- tions. His expertise provides key insights into the innovations required to enable advanced semicon- ductor packaging, high-density interconnects, and the next generation of AI scaling. and growing energy efficiency pressures. Thermal management and power delivery will become even more critical. Glass substrates and panel-level pack- aging are already introducing new materials chal- lenges. Photonics-electronics integration is already redefining interconnect strategies altogether. In each of these transitions, precision at scale will determine competitive advantage. At MKS, the strategic role is to enable that preci- sion across every layer of the AI hardware stack. By combining materials science, laser and photonics inno- vation, and atomic-level vacuum control, MKS supports manufacturers in overcoming escalating density, contamination, thermal, and reliability challenges. AI does not scale on algorithms alone. It scales on infrastructure—on the invisible layers of copper, silicon, surface chemistry, laser structuring, and vacuum-controlled environments that connect and cool the system. As AI continues to transform industries and soci- eties, MKS stands at the foundation of that trans- formation—enabling the interconnect technolo- gies that power the infrastructure of intelligence. I-CONNECT007