IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1547121
Are PCB Fabricators Are PCB Fabricators Ready for the Next Ready for the Next Technology Curve? Technology Curve? 96 I-CONNECT007 MAGAZINE I OCTOBER 2026 The electronics industry's demand for smaller, faster, and more powerful devices is driving major advances in PCB manufacturing. One of the central priorities is to increase circuit density while main- taining performance and reliability. Manufacturers produce finer lines and spaces so more components can fit on smaller, more sophisti- cated boards. They are also refining SMT features to support tighter pitches without compromising performance. As components shrink, smaller-diameter micro- vias and through-holes are becoming essential for connecting multiple PCB layers. Stacked microvias support dense signal routing and chip-to-chip communication, while 6+2+6 build-up constructions are becoming standard. Meeting Future Market Demands By advancing fabrication technologies and con- tinuously improving manufacturing processes, PCB manufacturers must position themselves to meet the electronics market's growing requirements for miniaturization, density, and performance. In the electronics manufacturing industry, the imperative to uphold signal integrity and ensure overall design reliability cannot be overstated. BY M I C H A E L CA R A N O, G LO BA L E L ECT RO N I C S AS S O C I AT I O N T RO U B L E I N YO U R TA N K