110 I-CONNECT007 MAGAZINE I OCTOBER 2026
tions may include stiffeners, PTHs, microvias, and
blind/buried vias. Revision F incorporates new and
updated requirements for rigid-to-flex transition
zones, printed board edge plating, printed board
cavities, dewetting, copper penetration as a func-
tion of wicking, etchback, and hole formation, and
also minimum dielectric spacing.
IPC-2591 V2.1, Connected Factory
Exchange (CFX)
IPC-2591 V2.1 standard establishes the require-
ments for the omnidirectional exchange of informa-
tion between manufacturing processes and associ-
ated host systems for assembly manufacturing. This
standard applies to communication between all
executable processes in the manufacture of printed
board assemblies, whether automated, semiau-
tomated, or manual, and to related mechanical
assembly and transactional processes. IPC-2591,
Version 1.7, includes enhancements for closed-loop
between AOI and SPI, and fields added to Heartbeat
to provide repeated active fault and recipe informa-
tion in each message. Visit www.ipc-cfx.org for soft-
ware developer resources, training programs and
information on the IPC-CFX-2591 Validation System
and Qualified Products List (QPL).
IPC-Hermes-9852 V1.7, The Global
Standard for Machine-to-Machine
Communication in SMT Assembly
IPC-Hermes-9852 V1.7 standard is an open, vendor-
neutral standard that replaces the legacy SMEMA
interface to enable seamless board-handover
communication between machines on an SMT
assembly line. By transmitting rich product and
process data alongside the physical handoff, it elim-
inates manual setup errors, reduces changeover
times, and serves as a foundational building block
for factory automation.
IPC J-STD-002F, Solderability Tests
for Component Leads, Terminations,
Lugs, Terminals, and Conductors
IPC J-STD-002F prescribes test methods, defect
definitions, acceptance criteria, and illustrations for
assessing the solderability of electronic component
leads, terminations, solid wires, stranded wires,
lugs, and tabs. The IPC-J-STD-002E standard also
includes a test method for the resistance to disso-
lution/dewetting of metallization. IPC-J-STD-002F
is intended for use by both supplier and user. The
IPC-J-STD-002F standard was developed by ECIA,
IPC and JEDEC.
IPC-4105, Specification for Metal
Base Copper Clad Laminates for
Rigid Printed Boards
IPC-4105 is a new document that covers the require-
ments for metal-base materials that are referred to
as metal-based laminate listed in the specification
sheets that are contained in the list of the main
body. These are to be used primarily for rigid and
multilayer printed boards for electronic intercon-
nections. I-CONNECT007
