IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1547121
info-atotech@mks.com www.atotech.com Next frontier of PCB manufacturing – Optimize the Interconnect ® Atotech pla ng equipment and process chemistries combined with ESI laser drilling systems We are committed to driving the next level of technology development in our industries and accelerating time to market through our combined capabilities. This allows us to look at problems holistically and provide customers and OEMs with faster development cycles for new products and materials that enable next-generation technologies. In PCB manufacturing, where precision is paramount, MKS delivers the winning combination for superior yields. Our strategic fusion of Atotech leading plating systems (Horizon ® / Uniplate ® / vPlate ® ) and process chemistries for LDD pre-treatment (BondFilm ® LDD), laser drilling splash removal (BondFilm ® LDD SR), desmear (Securiganth ® ), ionic activation (Neoganth ® ), electroless Cu metalli- zation (Printoganth ® P2) and electrolytic Cu filling (Inpulse ® / InPro ® ) with ESI Geode™ Via Drilling System for optimized laser drilling creates a breakthrough integrated approach. By addressing the complexities of intricate PCB designs and challenging materials, MKS ensures you stay ahead of the competition. Laser drilling & post-treatment Desmear, ionic-activation, metallization Laser pre-treatment For more information on our company or products, just scan the QR-code.