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22 I-CONNECT007 MAGAZINE I OCTOBER 2026 B U I L D I N G F O R W H AT 'S N E XT Designing the Physical System That thinking extends across the physical system. Heat generation and heat flow influence component placement, materials, copper distribution, and me- chanical design. Embedded components can free sur- face area and shorten electrical paths while introduc- ing additional fabrication and reliability considerations. Enclosures, airflow, connectors, and mounting points also shape what is practical at the board level. Rout- ing, impedance, stackups, materials, and signal integ- rity remain fundamental, with each decision contribut- ing to the performance of the complete system. Manufacturing capability is an important part of that equation. Fabrication rules reflect what a process can produce repeatedly and reliably, while continued advances in processes and materials expand the avail- able design space. A spacing requirement, construc- tion method, or feature size tied to one process may have additional options as capabilities evolve. One example that comes to mind is annular ring. Due to our exceptional registration capabilities, we can support smaller pads for a given via size, affording the designer greater routing density. At the edge of established PCB capability, that distinction creates valuable opportunities. A fabri- cator may be able to address a challenging require- ment through a different process, construction, or material approach. Understanding the intent behind the requirement gives both sides more room to identify the solution that best supports performance and manufacturability. Manufacturing Must Be Part of the Conversation For complex designs, manufacturability is most valu- able when it is part of the process from the beginning. Early collaboration gives designers access to a broad- er range of materials, fabrication processes, and con- struction options while the architecture is still taking shape. It also allows performance, reliability, manufac- turability, and cost to be considered together. The number one thing we tell our customers is to bring us in as early as possible on complex designs. We've worked on multiple projects where we have recommended an mSAP manufacturing process for a given layer rather than traditional subtractive etch. The immediate advantage is greater routing density through finer features, but the benefits can extend beyond density. When RF performance is the driver, the straighter sidewalls and tighter feature toler- ances achieved through mSAP can offer signifi- cantly improved performance over subtractively etched features. Engaging the fabricator early gives the design team an opportunity to identify those options while there is still flexibility in the design, helping avoid costly tear-ups, reroutes, and fabrication respins later in the process. Advanced fabrication brings together an under- standing of what the design is trying to accomplish with the materials, processes, and manufacturing capabilities that can help achieve it. The earlier that conversation happens, the more opportunity there is to optimize performance, manufacturability, and reliability together. Beyond the Board Boundary This is also why electrical, mechanical, and thermal engineering come together at the point where the product takes shape. Heat moves through materi- als and structures. Mechanical stress reaches com- ponents and interconnections. Geometry affects electrical behavior. Fabrication choices influence all of them, and the PCB often sits at the intersection. Recognizing when a board-level decision reaches beyond the board creates an opportunity to bring the right expertise into the conversation early and make those disciplines work together. As designs become more complex, the opportu- nity lies in looking beyond individual requirements and understanding how each decision connects to the larger system. That means bringing design, engineering, and manufacturing expertise together earlier, asking what the design is ultimately trying to achieve, and using the full range of capabilities available to get there. The future of advanced PCB design will be shaped by how well we connect those pieces, and how early we start the conversation. Michael Gleason is director of product development and strategic growth at GreenSource Fabrication.