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100 I-CONNECT007 MAGAZINE I OCTOBER 2026 T RO U B L E I N YO U R TA N K norm, while growth is shifting from consumer elec- tronics such as smartphones and tablets toward millimeter-wave technologies, 5G/6G, high-perfor- mance computing, CoWoS (chip-on-wafer-on-sub- strate), ADAS, and AI. Supporting these advances requires substantial upgrades in materials, processing equipment, laser drilling, in-circuit testing, registration, and lamina- tion. Progress demands more than a change in mindset; it requires strategic investment in tech- nology, capacity, quality, and workforce develop- ment. Companies must prepare engineers and manufacturing personnel to manage critical aspects of workflow, quality, delivery times, and yield. These improvements carry significant costs, but they are essential to moving up the technology curve. PCB fabricators should think like a semiconductor company: razor-sharp focus and relentless pursuit of higher yields, even as technology becomes more complex. Moving into sub-50-micron lines and spaces, and 75-micron-or-less blind-via diameters, is the new norm. To be even modestly successful, mastering laser via formation, laser direct imaging, precise registration, improved lamination presses, thin materials handling, precision metallization, electroplating, and etching is essential. Look outside the box and think about how you can minimize handling (to improve workflow as well as yields). A good example is the adoption of modular plating equipment that performs like a semicon- ductor wafer plating tool. Horizontal processing, including precision etching and metallization, is a game-changing process investment. As HDI and UHDI add more layers, why not invest in alterna- tive processes to make the vias conductive? Direct metallization is an alternative that not only reduces impact on the environment but also offers a precise, highly productive process compared to conven- tional electroless copper. Investments Needed Jumping the technology requirements curve today and moving forward requires significant investment. You can no longer bootstrap your way to prosperity. It is not only about microvias and substrates. There will always be a need for higher aspect ratio plated through-hole circuit boards. High layer counts and aspect ratios reaching and exceeding 30:1 are here. Just look at the server board requirements for AI. Mechanical drilling and plating of these high aspect ratio boards will require the latest in drill-bit design and CNC drilling equipment. Layer counts are ex- ceeding 32 layers. If that is not enough, thermal management becomes more difficult as these AI devices generate significant heat. Tight control of stub length and back-drill depth tolerance is important for high- speed designs. This matters for 800G/1.6T switch PCBs. Of course, blind and buried vias eliminate the unwanted stub. However, HDI with many sequential laminations is not always the best solution, espe- cially for large, high layer count networking boards. First, however, fabricators must master key tech- nologies and processing if they wish to be a credible supplier of this growing technology. This includes: • Tooling and materials selection • Small hole drilling and micro-drilling • High aspect ratio via formation • Back-drilling expertise • Laser via formation T RO U B L E I N YO U R TA N K " PCB fabricators should think like a semiconductor company: razor- sharp focus and relentless pursuit of higher yields, even as technology becomes more complex."