Direct Image Solder Mask
EMP110 LDI
Carapace ® EMP110 LDI
is the next generation in
Liquid Photoimageable
Soldermask for Direct
Imaging.
• Low Exposure Energy (50-80 mJcm-2) to
Resolve Small Features
• Tack-free Surface During Exposure
• Fine Solder-dam Resolution (50µm, 2mil)
• Lead-free Compatible
• High Chemical Resistance to ENIG & Sn
Processes
EMP110 LDI soldermask is ideally
suited for high-reliability, HDI
PCB production where ultimate
resolution and registration is
required.
The EMP110 LDI formulation has
been engineered to deliver straight
sidewalls and fine solder-dam
resolution over the wide range of
coating thicknesses associated with
screen-printed and sprayed PCBs.
Optimised radiation curing
characteristics deliver high levels of
through-cure at low energy levels
without compromise in surface tack
or chemical resistance.
• RoHS Compliant and Halogen Free
• Non Toxic
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