characteristics of epig deposits for fine-line applications continues
Figure 5: IMC observation and analysis of IMC composition by EDS with M705; EPIG (Pd 0.1 µm,
Au 0.1 µm) and ENEPIG (Ni-P 6 µm, Pd 0.1 µm, Au 0.1 µm) as plated.
Figure 6: IMC observation and analysis of IMC composition by EDS with M705; EPIG (Pd 0.1 µm,
Au 0.1 µm) and ENEPIG (Ni-P 6 µm, Pd 0.1 µm, Au 0.1 µm) after heat treatment.
18
The PCB Magazine • January 2014
